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German semiconductor manufacturer Infineon announced on Tuesday, October 27, 2026, that it will invest 1.1 billion euros ($1.23 billion) to expand its production facilities in Villach, Austria. The investment is aimed at increasing the manufacturing capacity of power semiconductors, specifically to support the growing demands of data centers. As part of this expansion, Infineon plans to construct the world’s first high-volume production facility for gallium nitride (GaN) semiconductors based on 300-millimeter wafers. According to the company, the transition to 300-millimeter wafers offers a significant efficiency advantage, as they can accommodate 2.3 times more chips than the 200-millimeter wafers currently used as the industry standard. Infineon CEO Jochen Hanebeck stated that the project is intended to facilitate the widespread adoption of gallium nitride technology across several critical sectors. "This paves the way for the broad use of gallium nitride in a wide range of key applications in areas such as artificial intelligence, energy infrastructure, electric mobility, and robotics," Hanebeck said in a statement. The announcement comes amid a challenging period for the company’s stock performance, which has declined by approximately 40% since mid-June. Following the news of the investment, Infineon shares saw a modest recovery, rising by nearly 1% in early trading in Frankfurt. Article source: 24 Orë | Image credit: 24 Orë
German semiconductor manufacturer Infineon announced on Tuesday, October 27, 2026, that it will invest 1.1 billion euros ($1.23 billion) to expand its production facilities in Villach, Austria. The investment is aimed at increasing the manufacturing capacity of power semiconductors, specifically to support the growing demands of data centers. As part of this expansion, Infineon plans to construct the world’s first high-volume production facility for gallium nitride (GaN) semiconductors based on 300-millimeter wafers. According to the company, the transition to 300-millimeter wafers offers a significant efficiency advantage, as they can accommodate 2.3 times more chips than the 200-millimeter wafers currently used as the industry standard. Infineon CEO Jochen Hanebeck stated that the project is intended to facilitate the widespread adoption of gallium nitride technology across several critical sectors. “This paves the way for the broad use of gallium nitride in a wide range of key applications in areas such as artificial intelligence, energy infrastructure, electric mobility, and robotics,” Hanebeck said in a statement. The announcement comes amid a challenging period for the company’s stock performance, which has declined by approximately 40% since mid-June. Following the news of the investment, Infineon shares saw a modest recovery, rising by nearly 1% in early trading in Frankfurt.
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